ADP2140
Data Sheet
Rev. A | Page 6 of 32
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VIN1
PG
EN1
EN2
VOUT2
10
9
8
7
6
PGND
SW
AGND
FB
VIN2
1
2
3
4
5
ADP2140
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE LFCSP PACKAGE ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GROUND
INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED PAD BE
CONNECTED TO THE GROUND PLANE ON THE CIRCUIT BOARD.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin
Mnemonic
Description
1
PGND
Power Ground.
2
SW
Connection from Power MOSFETs to Inductor.
3
AGND
Analog Ground.
4
FB
Feedback from Buck Output.
5
VIN2
LDO Input Voltage.
6
VOUT2
LDO Output Voltage.
7
EN2
Logic 1 to Enable LDO or No Connect for Autosequencing.
8
EN1
Logic 1 to Enable Buck or Initiate Sequencing. This is a dual function pin and the state of EN2 determines
which function is operational.
9
PG
Power Good. Open-drain output. PG is held low until both output voltages (which includes the external
inductor and capacitor sensed by the FB pin) rise above 92% of nominal value. PG is held high until both
outputs fall below 85% of nominal value.
10
VIN1
Analog Power Input.
EP
Exposed Pad. The exposed pad on the bottom of the LFCSP package enhances thermal performance and is
electrically connected to ground inside the package. It is recommended that the exposed pad be connected
to the ground plane on the circuit board.